Speedline Thermal Laminate Board
Speedline Thermal laminate is a insulated plasterboard solution comprising a PIR foam with a kraft paper/aluminium multi-layer finish, factory bonded to a 12.5mm tapered edge plasterboard offered in a board size of 1.2m x 2.4m. The foam has a very low thermal conductivity (k) of 0.022W/mK with the plasterboard providing an optimum thermal insulation solution.
Speedline Thermal Laminate Board is a versatile insulation and dry lining solution which may be installed in a variety of locations within a building. The following details are intended to provide an indication of both application and achieved performance within the noted construction build-up. The insulated plasterboard may be fixed to the substrate by adhesive bonding.
- Thermal Conductivity: 0.022W/mK
- R-Value: 2.87m2K/W
- Insulation Board size: 12.5mm
- Application: Wall and Ceiling